Thursday, 26 June 2014

ISTFA 2014 Oral Presentation Acceptance

TeraView are pleased to announce that we have had a the paper 'Non-Destructive Fault Isolation in Advanced IC Packages' accepted for oral presentation at ISTFA 2014!

This years event will be the 40th International Symposium for Testing and Failure Analysis, and will be held in Houston, Texas, November 9-13 2014.





ISTFA is where you’ll find researchers, engineers, technicians and others who work on discrete components, dies, wafer fabrication, packages, board assembly and systems. They’re your customers.
  • ISTFA is the only international venue devoted to the semiconductor, electronic sample preparation and imaging markets.
  • ISTFA attracts attendees from all major global geographic areas.
  • ISTFA offers a comprehensive practical and theoretical technical program that attracts the broadest mix of attendees.
  • ISTFA continually expands topic areas to attract new and diverse audiences.
  • ISTFA provides two full days of dedicated expo hours – make connections, build relationships, and generate sales.

For more information on ISTFA 2014 please visit: 
http://www2.asminternational.org/content/Events/istfa/index.jsp