TeraView are pleased to announce their attendance at this year’s ISTFA Conference & Exposition.
Teraview’s Dr. Ka Chung Lee will present a talk on Tuesday 3rd November, titled:
‘Fast Feature Based Non-Destructive Fault Isolation in 3D IC Packages Utilizing Virtual Known Good Device’
For more information on the event visit the ISTFA website here, you can view the program here.
Come and visit us at booth 105, a layout map of the event can be found here.
If you would like to organize a prior meeting please contact Mr Martin Igarashi
ISTFA is the premier event for the Failure Analysis of Microelectronics, attracting the who's who of the FA industry.
ISTFA 2015 will be held between November 1-5 at the Portland Convention Center, Portland, OR, USA
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