Terahertz (THz) time-domain imaging of power electronic devices is performed using the commercial TPSTM Spectra 3000 THz imaging and spectroscopy system. The dimensions of bond wires within power transistor packages are extracted and the time-of-flight tomography is used to illustrate depth profiling of features in the device package. The devices under test in this paper are plastic encapsulated. The encapsulation measures a few millimeters thick. The THz images obtained in the reflection mode demonstrate a potential tool for the non-destructive inspection of packaged power electronic devices.
This study was performed using TeraView's TPS Spectra 3000 system. (TeraView, Cambridge, UK)
Full Article: http://www.ijetae.com/files/Volume4Issue1/IJETAE_0114_69.pdf