Here is Stephane Barbeau from IBM for his talk:
ElectroElectro Optical Terahertz Pulse Reflectometry - a Fast and Highly Accurate Non-Destructive Fault Isolation Technique for 3D Flip Chip Packages
As well as the TeraView Booth.
 |
| Stephane Barbeau |
Thursday, 7 November 2013
TeraView at ISTFA 2013
TeraView were recently at ISTFA 2013 from the 4th - 7th of November.
Here is Stephane Barbeau from IBM for his talk:
ElectroElectro Optical Terahertz Pulse Reflectometry - a Fast and Highly Accurate Non-Destructive Fault Isolation Technique for 3D Flip Chip Packages
As well as the TeraView Booth.
Here is Stephane Barbeau from IBM for his talk:
ElectroElectro Optical Terahertz Pulse Reflectometry - a Fast and Highly Accurate Non-Destructive Fault Isolation Technique for 3D Flip Chip Packages
As well as the TeraView Booth.
Subscribe to:
Post Comments (Atom)
No comments:
Post a Comment