Monday, 29 July 2013

TeraView at EMPC 2013 - European Microelectronics and Packaging Conference

TeraView will be attending EMPC 2013 (European Microelectronics and Packaging Conference).
TeraView will be presenting the paper by the title "Non-Destructive Fault localization in Advanced IC Packages Using Electro Optical Terahertz Pulse Reflectometry"  in session WP6 in the afternoon of the 11th of September.




Please contact Jesse Alton if you would like to arrange a meeting.

To view a list of all our events visit TeraView`s events webpage


Conference Overview

IMAPS-Europe European Microelectronics and Packaging Conference EMPC is the Major Electronics packaging, interconnection and integration conference of Europe.
EMPC-2013 is co-sponsored by IMAPS-Europe and IEEE-CPMT and builds upon the successful IEEE Electronics System-Integration Technology Conference ESTC (2010, Berlin) and EMPC-2011, Brighton. Each biennial event attracted over 350 delegates worldwide.