White, Tom, Jesse Alton, Brett Gibson, Martin Igarashi, Joy Liao, Timothy Pham, and Howard Marks. "Recent Developments in EOTPR Towards a Fully Automated Tool for High Volume Failure Analysis." In 2025 IEEE International Reliability Physics Symposium (IRPS), pp. 1-5. IEEE, 2025.
Abstract
Developments in backside power delivery (BPD) technology will become increasingly important for advanced semiconductors, but will present new challenges for failure analysis (FA) labs. Electro-Optical TeraHertz Pulsed Reflectometry (EOTPR) is a well-established electrical FA technique for package level open and leakage faults, but has comparatively little use for detecting die-level faults. Here, two case studies are presented that demonstrate how EOTPR can be used to localize faults within a die, highlighting how EOTPR could be utilized for BPD devices. Recent and future key developments in EOTPR are also presented.
