EOTPR Fine Pitch Probing for Die-to-Die Interconnect Failure Analysis

 Zee, Bernice, Wen Qiu, Aaron Wai Ken Lee, Jesse Alton, Thomas White, David Kim, and Martin Igarashi. "EOTPR Fine Pitch Probing for Die-to-Die Interconnect Failure Analysis." In International Symposium for Testing and Failure Analysis, vol. 85212, pp. 400-403. ASM International, 2025.

Abstract

Debug and physical failure analysis (PFA) of heterogeneously integrated semiconductor packages, particularly die-to-die (D2D) input/output (I/O) type fails, has become very challenging due to the lack of direct access to the I/Os from the package substrate to do static open/shorts fault isolation and limited test program granularity to determine which location along the D2D interconnect trace is failing. Thus, a suitable electrical fault isolation technique is required to ensure high success rate for root cause analysis. This paper discusses how EOTPR is used to isolate defects on a D2D interconnect trace of a chiplet advanced packaging using local silicon bridge with reasonable accuracy. Minimal sample preparation was needed to expose the I/O bumps for probing, thus minimizing the risk of artifacts that may cause the defect to be lost. A case study will demonstrate the successful application of the technique.

see https://dl.asminternational.org/istfa/proceedings/ISTFA2025/85212/400/35215